Burn-In & Test System
AF 8652
Simultaneous measurement of 15,552 devices Supports RambusR, DDR-SDRAM, Flash and Embedded Memories. This new test and burn-in system has been proven to be cost effective when testing today’s memory devise.
Spec.
�隉E1 zone(temp/control), 48 BIB, 4 rack, 12 BIB/rack
�隉E40 mm pitch
�隉Etemperature : -10°c ~ 150°c
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Wafer Level Burn-In System
DM2500
�隉ETest Frequency: 10MHz
�隉EParallel dut: 128 DUT/STN (opt.144DUT/STN)
�隉EMax. station: 2 STN/ System
�隉EBus control is PCI 32bit-bus interface
�隉EALPG is same Memory-Test-System
�隉EDC,VS Auto Performance check function
�隉EWave Form Monitoring (WFM) function |
